类型 | 描述 |
---|---|
系列: | GoldMax 300 Comm C0G |
包裹: | Bulk |
零件状态: | Active |
电容: | 91 pF |
宽容: | ±10% |
额定电压: | 25V |
温度系数: | C0G, NP0 |
工作温度: | -55°C ~ 125°C |
特征: | Low ESL |
收视率: | - |
应用: | General Purpose |
失败率: | - |
安装类型: | Through Hole |
包/箱: | Radial |
尺寸/尺寸: | 0.200" L x 0.125" W (5.08mm x 3.18mm) |
坐姿高度(最大): | 0.300" (7.62mm) |
厚度(最大): | - |
引线间距: | 0.100" (2.54mm) |
领导风格: | Formed Leads - Kinked |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
GMC21CG151J16NTCAL-CHIP ELECTRONICS INC. |
CAP0805 COG 150PF 5% 16V |
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CAP CER 100PF 16V X7R 1808 |
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2225J5000683KXTSyfer |
CAP CER 0.068UF 500V X7R 2225 |
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C0805X563J4JACAUTOKEMET |
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CAP CER 33PF 5KV C0G/NP0 1825 |
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1812J0500181JFRSyfer |
CAP CER 180PF 50V C0G/NP0 1812 |
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2220J1K00683JXTSyfer |
CAP CER 0.068UF 1KV X7R 2220 |
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CAP CER 1210 91PF 10V ULTRA STAB |