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CAP SILICON 20PF 20% 50V SMD
THERM PAD 150MMX150MM GRAY
CONN STRAIN RELIEF 4POS BLK 1=25
CONN SHUNT
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| 类型 | 描述 |
|---|---|
| 系列: | MBC50 |
| 包裹: | Tray |
| 零件状态: | Active |
| 电容: | 20 pF |
| 宽容: | ±20% |
| 电压 - 击穿: | 50 V |
| esr（等效串联电阻）: | - |
| esl（等效串联电感）: | - |
| 应用: | High Stability |
| 特征: | - |
| 工作温度: | -55°C ~ 200°C |
| 包/箱: | Nonstandard Chip |
| 高度: | 0.179" (4.55mm) |
| 尺寸/尺寸: | 1.417" L x 0.512" W (36.00mm x 13.00mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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