THERMAL INTERFACE PAD, GAP PAD,
IC RAM 1MBIT PARALLEL 44TSOP2
类型 | 描述 |
---|---|
系列: | λGEL™ RE |
包裹: | Bulk |
零件状态: | Active |
用法: | - |
类型: | Gel Pad, Sheet |
形状: | Square |
大纲: | 200.00mm x 200.00mm |
厚度: | 0.0390" (0.991mm) |
材料: | Silicone Gel |
粘合剂: | Tacky - Both Sides |
后盾,载体: | - |
颜色: | Black |
热电阻率: | - |
导热系数: | 2.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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