类型 | 描述 |
---|---|
系列: | THERMFLOW® T777 |
包裹: | Bulk |
零件状态: | Active |
用法: | - |
类型: | Gap Filler Pad, Sheet |
形状: | Square |
大纲: | 152.40mm x 152.40mm |
厚度: | 0.0045" (0.115mm) |
材料: | Polymer Solder Hybrid |
粘合剂: | Tacky - Both Sides |
后盾,载体: | - |
颜色: | Gray |
热电阻率: | - |
导热系数: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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