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| 类型 | 描述 |
|---|---|
| 系列: | THERMFLOW® T777 |
| 包裹: | Strip |
| 零件状态: | Active |
| 用法: | - |
| 类型: | Gap Filler Pad, Sheet |
| 形状: | Square |
| 大纲: | 28.00mm x 28.00mm |
| 厚度: | 0.0045" (0.115mm) |
| 材料: | Polymer Solder Hybrid |
| 粘合剂: | Tacky - Both Sides |
| 后盾，载体: | - |
| 颜色: | Gray |
| 热电阻率: | - |
| 导热系数: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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