类型 | 描述 |
---|---|
系列: | ULTRAPURE® |
包裹: | Bulk |
零件状态: | Active |
类型: | Bar Solder |
作品: | Sn95.5Ag3.9Cu0.6 (95.5/3.9/0.6) |
直径: | - |
熔点: | - |
助焊剂类型: | - |
线规: | - |
过程: | Lead Free |
形式: | Bar, 1.66 lbs (750g) |
保质期: | - |
保质期开始: | - |
储存/冷藏温度: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
SSLFNC-50GSRA Soldering Products |
SAC 305 LEAD FREE SOLDER PASTE T |
|
70-4006-2010Kester |
SOLDER PASTE NO CLEAN 500GM |
|
SMD2055-25000Chip Quik, Inc. |
SOLDER SPHERES SAC305 DIAMETER 2 |
|
96-7069-9540Kester |
SN96.5AG3.0CU0.5 3.3%/268 .040 5 |
|
24-7080-9710Kester |
SOLDER FLUX-CORED/285 .031" 1LB |
|
70-4021-1411Kester |
SOLDER PASTE NO CLEAN 600GM |
|
26-6337-8817Kester |
SOLDER FLUX-CORED/245 63/37.062" |
|
SMD3SWLT.047 1OZChip Quik, Inc. |
SOLDER WIRE SN42/BI58 .047" 1OZ |
|
TS391AXChip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
|
WS991SNL500T4Chip Quik, Inc. |
SOLDER PASTE THERMALLY STABLE WS |
|
NC191AX15Chip Quik, Inc. |
SMOOTH FLOW LEADED SOLDER PASTE |
|
70-1003-0611Kester |
SOLDER PASTE WATER SOLUBLE 600GM |
|
WBNCC633731-4OZSRA Soldering Products |
NO-CLEAN FLUX CORE SOLDER, 63/37 |