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BT 5.1 MODULE
SILICONE FOAM SHEET, T6.0 X 300
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Tray |
| 零件状态: | Active |
| 射频系列/标准: | 802.15.4, Bluetooth/ANT |
| 协议: | ANT®, Bluetooth v5.1, Thread, Zigbee® |
| 调制: | - |
| 频率: | 2.36GHz ~ 2.5GHz |
| 数据速率: | 2Mbps |
| 功率输出: | 8dBm |
| 灵敏度: | -104dBm |
| 串行接口: | ADC, GPIO, I²C, SPI, PDM, UART, USB |
| 天线类型: | Integrated, Chip |
| 使用 ic / 零件: | nRF52 |
| 内存大小: | 512kB Flash, 128kB SRAM |
| 电压 - 电源: | 1.7V ~ 3.6V |
| 电流接收: | 6mA |
| 电流传输: | 3.5mA ~ 6.1mA |
| 安装类型: | Surface Mount |
| 工作温度: | -40°C ~ 105°C |
| 包/箱: | 62-SMD Module |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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