类型 | 描述 |
---|---|
系列: | VI Chip® BCM® (200W) |
包裹: | Tray |
零件状态: | Active |
类型: | Bus Converter Module |
输出数量: | 1 |
电压 - 输入(最小值): | 38V |
电压 - 输入(最大值): | 55V |
电压 - 输出 1: | 4V |
电压 - 输出 2: | - |
电压 - 输出 3: | - |
电压 - 输出 4: | - |
电流 - 输出(最大值): | 53A |
功率(瓦): | 200 W |
电压 - 隔离: | 2.25 kV |
应用: | ITE (Commercial) |
特征: | Remote On/Off, OCP, OTP, OVP, SCP, UVLO |
工作温度: | -55°C ~ 125°C |
效率: | 94.1% |
安装类型: | Through Hole |
包/箱: | Module |
尺寸/尺寸: | 1.28" L x 0.87" W x 0.26" H (32.5mm x 22.0mm x 6.7mm) |
供应商设备包: | - |
控制功能: | - |
审批机构: | - |
标准号: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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