CONTACT SMD GOLD
IC I/O EXPANDER I2C 8B 16SOIC
类型 | 描述 |
---|---|
系列: | - |
包裹: | Tape & Reel (TR)Cut Tape (CT) |
零件状态: | Active |
联系方式: | Contact Pad |
安装类型: | Surface Mount |
最大工作高度: | - |
推荐工作高度: | - |
最小工作高度: | - |
焊盘布局尺寸: | Rectangular - 0.150" L x 0.118" W x 0.020" H (3.80mm x 3.00mm x 0.50mm) |
操作力 - 初始: | - |
操作力 - 中压缩: | - |
柱塞尺寸: | - |
特征: | - |
交配周期: | - |
接触材料: | Beryllium Copper |
接触完成: | Gold |
接触面厚度: | Flash |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
90151-ASPreci-Dip |
CONTACT SPRING LOADED SMD GOLD |
|
XP3B-3829-5050-1-D/TOmron Electronics Components |
CONTACT SPRING LOADED T/H GOLD |
|
P70-2000045RHarwin |
CONTACT SPRING LOADED T/H GOLD |
|
807-22-001-30-006101Mill-Max |
CONTACT SPRING LOADED SMD GOLD |
|
90161-ASPreci-Dip |
CONTACT SPRING LOADED SMD GOLD |
|
H027LL1A-1CPlastronics Sockets & Connectors |
SPRING PROBE .27MM X 2.89MM HPIN |
|
0985-0-15-20-71-14-11-0Mill-Max |
CONTACT SPRING LOADED T/H GOLD |
|
806-22-001-10-003191Mill-Max |
CONTACT SPRING LOADED T/H GOLD |
|
2429Adafruit |
CONTACT SPRING LOADED SMD 10PC |
|
806-22-001-10-002191Mill-Max |
CONTACT SPRING LOADED T/H GOLD |
|
0906-0-15-20-76-14-11-0Mill-Max |
CONTACT SPRING LOADED T/H GOLD |
|
90022-ASPreci-Dip |
CONTACT SPRING LOADED SMD GOLD |
|
90233-ASPreci-Dip |
CONTACT SPRING LOADED SMD GOLD |