CONN FPC BOTTOM 23POS 1.00MM R/A
MODBUS,1E,SER,GSMMOLEX GE
类型 | 描述 |
---|---|
系列: | - |
包裹: | Tape & Reel (TR)Cut Tape (CT) |
零件状态: | Active |
扁平弯曲型: | FPC |
安装类型: | Surface Mount, Right Angle |
连接器/触点类型: | Contacts, Bottom |
职位数: | 23 |
沥青: | 0.039" (1.00mm) |
终止: | Solder |
ffc, fcb 厚度: | 0.30mm |
离板高度: | 0.101" (2.56mm) |
锁定功能: | Slide Lock |
电缆端型: | Straight |
接触材料: | Phosphor Bronze |
接触完成: | Tin |
筑屋材料: | Liquid Crystal Polymer (LCP), Glass Filled |
执行器材料: | Polyamide (PA), Nylon, Glass Filled |
特征: | Solder Retention, Zero Insertion Force (ZIF) |
额定电压: | 200V |
工作温度: | -40°C ~ 85°C |
材料可燃性等级: | UL94 V-0 |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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