MDL, DUAL, XFMR-CMC, 1:1, 4.3KV,
CONN HDR 9POS SMD TIN
类型 | 描述 |
---|---|
系列: | DF9 |
包裹: | Tape & Reel (TR)Cut Tape (CT) |
零件状态: | Active |
连接器类型: | Header, Center Strip Contacts |
职位数: | 9 |
沥青: | 0.039" (1.00mm) |
行数: | 2 |
安装类型: | Surface Mount |
特征: | Board Guide, Solder Retention |
接触完成: | Tin |
接触面厚度: | 39.4µin (1.00µm) |
配对堆叠高度: | 4.3mm |
离板高度: | 0.130" (3.30mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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