WIRE-TO BOARD WAFER, 2.5MM, 12 C
CRYSTAL 48.0000MHZ 18PF SMD
CONN COMPACT FLASH CARD SNAP-IN
类型 | 描述 |
---|---|
系列: | - |
包裹: | Bag |
零件状态: | Active |
连接器类型: | Header |
联系方式: | Male Pin |
俯仰交配: | 0.098" (2.50mm) |
职位数: | 12 |
行数: | 1 |
行距 - 交配: | - |
加载的位置数: | All |
风格: | Board to Cable/Wire |
笼罩: | Shrouded - 4 Wall |
安装类型: | Through Hole |
终止: | Solder |
紧固类型: | Detent Lock |
接触长度 - 交配: | - |
接触长度 - 后: | 0.138" (3.50mm) |
总接触长度: | - |
绝缘高度: | 0.232" (5.90mm) |
接触形状: | Circular |
接触完成 - 交配: | Tin |
接触表面厚度 - 配合: | - |
接触完成 - 发布: | Tin |
接触材料: | Brass |
绝缘材料: | Polyamide (PA66), Nylon 6/6 |
特征: | - |
工作温度: | -40°C ~ 85°C |
入口保护: | - |
材料可燃性等级: | UL94 V-0 |
绝缘颜色: | Beige |
额定电流(安培): | 3A |
额定电压: | 250V |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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