CONN IC DIP SOCKET 8POS TIN
RF SHIELD 1.5" X 3.5" T/H
类型 | 描述 |
---|---|
系列: | iCF |
包裹: | Tape & Reel (TR)Cut Tape (CT) |
零件状态: | Active |
类型: | DIP, 0.3" (7.62mm) Row Spacing |
位置或引脚数(网格): | 8 (2 x 4) |
俯仰交配: | 0.100" (2.54mm) |
接触完成 - 交配: | Tin |
接触表面厚度 - 配合: | - |
接触材料 - 配合: | Beryllium Copper |
安装类型: | Surface Mount |
特征: | Open Frame |
终止: | Solder |
投稿: | 0.100" (2.54mm) |
接触完成 - 发布: | Tin |
接触完成厚度 - 后: | - |
联系材料 - 帖子: | Beryllium Copper |
筑屋材料: | Liquid Crystal Polymer (LCP) |
工作温度: | -55°C ~ 125°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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