BATT HLDR COIN 20MM 1/2 CELL SMD
CONN SPLICE 20-24 AWG CRIMP PIDG
IC DRAM 256MBIT PAR 66TSOP II
类型 | 描述 |
---|---|
系列: | PIDG |
包裹: | Bulk |
零件状态: | Active |
终端类型: | Butt Splice, Inline, Individual Openings |
电线入口数: | 2 |
终止: | Crimp |
线规: | 20-24 AWG |
绝缘: | Fully Insulated |
特征: | Serrated Mating Area |
颜色: | Natural |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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