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| 类型 | 描述 |
|---|---|
| 系列: | 655 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Thermal Tape, Adhesive (Not Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.600" (40.64mm) |
| 宽度: | 1.600" (40.64mm) |
| 直径: | - |
| 翅片高度: | 0.260" (6.60mm) |
| 功耗@温升: | 5.0W @ 60°C |
| 热阻@强制气流: | 3.00°C/W @ 500 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
0372504040Woodhead - Molex |
CHIPSET COOLER CU #1 6500 RPM |
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HEATSINK 40X40X25MM XCUT T766 |
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ATS-02B-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
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ATS-52250B-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 25X25X7.5MM W/OUT TIM |
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HEATSINK 17X17X7.5MM W/OUT TIM |
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ATS-54250R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 25X25X19.5MM W/OUT TIM |
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574802B03300GAavid |
BOARD LEVEL HEAT SINK |
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ATS-P2-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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2328BGAavid |
HEAT SINK |
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581002B02100GAavid |
BOARD LEVEL HEAT SINK |
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ATS-10G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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623KWakefield-Vette |
HEAT SINK PWR NO MNT HOLES BLK |
