English
简体中文
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | 431 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Board Level, Extrusion |
| 包冷却: | Stud Mounted Diode |
| 附着方式: | Press Fit |
| 形状: | Rectangular, Fins |
| 长度: | 3.000" (76.20mm) |
| 宽度: | 4.750" (120.65mm) |
| 直径: | - |
| 翅片高度: | 3.000" (76.20mm) |
| 功耗@温升: | 50.0W @ 55°C |
| 热阻@强制气流: | 0.40°C/W @ 250 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
ATS-12B-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
669-33ABT3Wakefield-Vette |
HEATSINK ASSY FOR SPGA |
|
|
ATS-54425R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 42.5X42.5X19.5MM NO TIM |
|
|
ATS-09E-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
532802B02500GAavid |
BOARD LEVEL HEAT SINK |
|
|
ATS-61300W-C2-R0Advanced Thermal Solutions, Inc. |
MAXIGRIP FANSINK 30X30X24.5MM |
|
|
ATS-X51400K-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 39.25X39.25X14.5MM T766 |
|
|
HSET970-2iBASE Technology |
HEAT SPREADER FOR ET970 (H051HSE |
|
|
D10850-40T1EWakefield-Vette |
HEATSINK 128PQFP COMPOSITE |
|
|
ATS-21C-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
39880100070Emerson Embedded Power (Artesyn Embedded Technologies) |
HEATSINK 1/4 BRICK VERT |
|
|
658-25ABT5Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
|
|
1-1542001-2TE Connectivity AMP Connectors |
HS ASSY PPA CLIP |
