English
简体中文
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | 626 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Board Level, Vertical |
| 包冷却: | TO-218, TO-220, TO-247 |
| 附着方式: | Bolt On and PC Pin |
| 形状: | Rectangular, Fins |
| 长度: | 0.500" (12.70mm) |
| 宽度: | 1.375" (34.93mm) |
| 直径: | - |
| 翅片高度: | 2.500" (63.50mm) |
| 功耗@温升: | 6.0W @ 48°C |
| 热阻@强制气流: | 4.20°C/W @ 200 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
ATS-11A-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
TX31847RCTS Corporation |
HEAT SINK ELECT ISO TO-18 |
|
|
519803B00000GAavid |
BOARD LEVEL HEAT SINK |
|
|
ATS-55325D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X9.5MM NO TIM |
|
|
698-80ABWakefield-Vette |
HEATSINK EXTRUSION 45MM |
|
|
ATS-54325K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X14.5MM NO TIM |
|
|
ATS-05C-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
HSIB906-BGAiBASE Technology |
AC, HEATSINK FOR IB906F-1G, (ROH |
|
|
ATS-X51250R-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 24.25X24.25X19.5MM T766 |
|
|
401VWakefield-Vette |
HEATSINK POWER TO-3 |
|
|
132-15.5BWakefield-Vette |
HEATSINK EXTRUDED |
|
|
40530Vicor |
BOM HTSNK BOTTOM 6123 CHIP 19M |
|
|
628-40ABT1EWakefield-Vette |
HEATSINK FOR 45MM BGA |
