







MEMS OSC XO 31.2500MHZ H/LV-CMOS
THERM PAD 104.1MMX73.7MM W/ADH
CONN PLUG FMALE 10P SOLDER CUP
IC SUPERVISOR 1 CHANNEL SOT25
| 类型 | 描述 |
|---|---|
| 系列: | Ti900 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 用法: | Power Module |
| 类型: | Die-Cut Pad, Sheet |
| 形状: | Rectangular |
| 大纲: | 104.10mm x 73.70mm |
| 厚度: | 0.0050" (0.127mm) |
| 材料: | Silicone |
| 粘合剂: | Adhesive - Both Sides |
| 后盾,载体: | Viscose |
| 颜色: | White |
| 热电阻率: | - |
| 导热系数: | 1.8W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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