THERMAL PAD, 6W/M K, 1.0MM
MICRO SIM PUSH-PUSH 6P SMT
类型 | 描述 |
---|---|
系列: | - |
包裹: | Bulk |
零件状态: | Active |
用法: | - |
类型: | Interface Pad, Sheet |
形状: | Square |
大纲: | 150.00mm x 150.00mm |
厚度: | 0.0394" (1.000mm) |
材料: | Silicone |
粘合剂: | - |
后盾,载体: | - |
颜色: | Gray |
热电阻率: | - |
导热系数: | 6.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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