3.2X2.5 20PPM @25C 20PPM (-40 TO
THERM PAD 406.4MMX203.2MM BLACK
IC MCU 32BIT
类型 | 描述 |
---|---|
系列: | Gap Pad® EMI 1.0 |
包裹: | Bulk |
零件状态: | Active |
用法: | - |
类型: | Gap Filler Pad, Sheet |
形状: | Rectangular |
大纲: | 406.40mm x 203.20mm |
厚度: | 0.0600" (1.524mm) |
材料: | - |
粘合剂: | Tacky - One Side |
后盾,载体: | Fiberglass |
颜色: | Black |
热电阻率: | - |
导热系数: | 1.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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