THERM PAD 19.5MMX12.7MM RED
HEATSINK 45X45X35MM R-TAB T766
CONN INSULATOR HSG 50POS 1.27MM
IC MCU 32BIT ROMLESS 256MAPBGA
类型 | 描述 |
---|---|
系列: | TG6050 |
包裹: | Box |
零件状态: | Not For New Designs |
用法: | - |
类型: | Conductive Pad, Sheet |
形状: | Rectangular |
大纲: | 19.50mm x 12.70mm |
厚度: | 0.0790" (2.000mm) |
材料: | Silicone Elastomer |
粘合剂: | Tacky - Both Sides |
后盾,载体: | - |
颜色: | Red |
热电阻率: | - |
导热系数: | 6.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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