THERM PAD 115MMX90MM W/ADH WHITE
IC EEPROM 8KBIT I2C 400KHZ 8SO
类型 | 描述 |
---|---|
系列: | NASBIS |
包裹: | Bulk |
零件状态: | Active |
用法: | Heat Isolation |
类型: | Insulator Pad, Sheet |
形状: | Rectangular |
大纲: | 115.00mm x 90.00mm |
厚度: | 0.0394" (1.000mm) |
材料: | Silica |
粘合剂: | Adhesive - One Side |
后盾,载体: | Polyester |
颜色: | White |
热电阻率: | - |
导热系数: | 0.02W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
COH-3114LVC-400-30Taica Corporation |
THERMAL INTERFACE PAD, GAP PAD, |
|
TG-A2200-300-150-0.5t-Global Technology |
SILICONE THERMAL PAD 300X150X0.5 |
|
DTT44-320-320-2.5 |
THERMAL PAD, SHEET 320X320MM, TH |
|
EYG-A091205PMPanasonic |
THERM PAD 115MMX90MM W/ADH GRAY |
|
40101020Würth Elektronik Midcom |
WE-TGF THERMAL GAP FILLER PAD RE |
|
LI98-320-320-0.15t-Global Technology |
THERM PAD 320MMX320MM W/ADH WHT |
|
COH-4065LVC-400-30-1NTTaica Corporation |
THERMAL INTERFACE PAD, GAP PAD, |
|
TG-A4040-300-300-2.0t-Global Technology |
THERM PAD 300MMX300MM BLUE |
|
TG-AH486-35-10-7.0-0t-Global Technology |
THERM PAD 35MMX10MM GRAY |
|
TG-A1250-30-30-0.5t-Global Technology |
THERM PAD A1250 30X30X0.5MM |
|
Q3-0.005-00-48Henkel / Bergquist |
THERM PAD 25.4MMX25.4MM BLACK |
|
SF400-101005CUI Devices |
THERM PAD 10MMX10MM 1 SHT=779PC |
|
TG-A1660-160-160-1.0t-Global Technology |
SILICONE THERMAL PAD 160X160X1.0 |