THERM PAD 41.91MMX28.96MM W/ADH
SMA-SP/MMCX-SP G174 1.5M
IC REG LINEAR 1.1V 20MA TO92-3
IC MCU 32BIT 256KB FLSH 176LFBGA
类型 | 描述 |
---|---|
系列: | L37-3F |
包裹: | Bulk |
零件状态: | Active |
用法: | TO-3 |
类型: | Die-Cut Pad, Sheet |
形状: | Rhombus |
大纲: | 41.91mm x 28.96mm |
厚度: | 0.0100" (0.254mm) |
材料: | Silicone Elastomer |
粘合剂: | Adhesive - Both Sides |
后盾,载体: | - |
颜色: | Yellow |
热电阻率: | - |
导热系数: | 1.4W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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