IC EEPROM 1KBIT SPI 2MHZ 8SOIC
THERM PAD 228.6MMX228.6MM GREEN
类型 | 描述 |
---|---|
系列: | Tflex™ 300 |
包裹: | Bulk |
零件状态: | Active |
用法: | - |
类型: | Gap Filler Pad, Sheet |
形状: | Square |
大纲: | 228.60mm x 228.60mm |
厚度: | 0.0600" (1.524mm) |
材料: | Silicone Elastomer |
粘合剂: | - |
后盾,载体: | - |
颜色: | Green |
热电阻率: | 2.11°C/W |
导热系数: | 1.2W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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