类型 | 描述 |
---|---|
系列: | MAX® 10 |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | 1000 |
逻辑元件/单元的数量: | 16000 |
总内存位: | 562176 |
输入/输出数: | 178 |
门数: | - |
电压 - 电源: | 1.15V ~ 1.25V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 100°C (TJ) |
包/箱: | 256-LBGA |
供应商设备包: | 256-FBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
LFE2-12SE-6TN144ILattice Semiconductor |
IC FPGA 93 I/O 144TQFP |
|
LFE3-17EA-7MG328CLattice Semiconductor |
IC FPGA 116 I/O 328CSBGA |
|
M2GL060TS-FGG676Roving Networks / Microchip Technology |
IC FPGA 387 I/O 676FBGA |
|
10M08DAU324I7GIntel |
IC FPGA 246 I/O 324UBGA |
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XC4025E-4HQ240IRochester Electronics |
FPGA, 1024 CLBS, 15000 GATES, 11 |
|
A54SX32A-1FGG256IRoving Networks / Microchip Technology |
IC FPGA 203 I/O 256FBGA |
|
XC6VSX315T-3FFG1156CXilinx |
IC FPGA 600 I/O 1156FCBGA |
|
A54SX32A-2TQG144IRoving Networks / Microchip Technology |
IC FPGA 113 I/O 144TQFP |
|
LCMXO3LF-2100C-6BG256ILattice Semiconductor |
IC FPGA 206 I/O 256CABGA |
|
10AX032H3F35I2SGIntel |
IC FPGA 384 I/O 1152FBGA |
|
10AX066N2F40I2LGIntel |
IC FPGA 588 I/O 1517FCBGA |
|
M2GL090-FGG676IRoving Networks / Microchip Technology |
IC FPGA 425 I/O 676FBGA |
|
EPF10K130EFC672-2XRochester Electronics |
EPF10K130 - FLEX 10KE PLD |