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| 类型 | 描述 |
|---|---|
| 系列: | ECP3 |
| 包裹: | Tray |
| 零件状态: | Active |
| 实验室/俱乐部数量: | 2125 |
| 逻辑元件/单元的数量: | 17000 |
| 总内存位: | 716800 |
| 输入/输出数: | 116 |
| 门数: | - |
| 电压 - 电源: | 1.14V ~ 1.26V |
| 安装类型: | Surface Mount |
| 工作温度: | 0°C ~ 85°C (TJ) |
| 包/箱: | 328-LFBGA, CSBGA |
| 供应商设备包: | 328-CSBGA (10x10) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
M2GL060TS-FGG676Roving Networks / Microchip Technology |
IC FPGA 387 I/O 676FBGA |
|
10M08DAU324I7GIntel |
IC FPGA 246 I/O 324UBGA |
|
XC4025E-4HQ240IRochester Electronics |
FPGA, 1024 CLBS, 15000 GATES, 11 |
|
A54SX32A-1FGG256IRoving Networks / Microchip Technology |
IC FPGA 203 I/O 256FBGA |
|
XC6VSX315T-3FFG1156CXilinx |
IC FPGA 600 I/O 1156FCBGA |
|
A54SX32A-2TQG144IRoving Networks / Microchip Technology |
IC FPGA 113 I/O 144TQFP |
|
LCMXO3LF-2100C-6BG256ILattice Semiconductor |
IC FPGA 206 I/O 256CABGA |
|
10AX032H3F35I2SGIntel |
IC FPGA 384 I/O 1152FBGA |
|
10AX066N2F40I2LGIntel |
IC FPGA 588 I/O 1517FCBGA |
|
M2GL090-FGG676IRoving Networks / Microchip Technology |
IC FPGA 425 I/O 676FBGA |
|
EPF10K130EFC672-2XRochester Electronics |
EPF10K130 - FLEX 10KE PLD |
|
XA6SLX25T-2FGG484QXilinx |
IC FPGA 250 I/O 484FBGA |
|
EP2SGX60EF1152C3NIntel |
IC FPGA 534 I/O 1152FBGA |
