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| 类型 | 描述 |
|---|---|
| 系列: | Fusion® |
| 包裹: | Tray |
| 零件状态: | Active |
| 实验室/俱乐部数量: | - |
| 逻辑元件/单元的数量: | - |
| 总内存位: | 276480 |
| 输入/输出数: | 252 |
| 门数: | 1500000 |
| 电压 - 电源: | 1.425V ~ 1.575V |
| 安装类型: | Surface Mount |
| 工作温度: | 0°C ~ 85°C (TJ) |
| 包/箱: | 676-BGA |
| 供应商设备包: | 676-FBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
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EP2AGX95EF29C6GIntel |
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IC FPGA 203 I/O 256FBGA |
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XC5VLX50T-2FFG665IXilinx |
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