类型 | 描述 |
---|---|
系列: | Fusion® |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | - |
逻辑元件/单元的数量: | - |
总内存位: | 276480 |
输入/输出数: | 252 |
门数: | 1500000 |
电压 - 电源: | 1.425V ~ 1.575V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 100°C (TJ) |
包/箱: | 676-BGA |
供应商设备包: | 676-FBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
LCMXO3D-4300HC-5SG72CLattice Semiconductor |
IC FPGA MACHXO3D 4300LUT 72QFN |
|
5AGZME7H2F35I3LGIntel |
IC FPGA 534 I/O 1152FBGA |
|
5SGXEB9R1H43I2GIntel |
IC FPGA 600 I/O 1760HBGA |
|
5SGXEA5K3F35C2LGIntel |
IC FPGA 432 I/O 1152FBGA |
|
5SGXMA4H3F35C4GIntel |
IC FPGA 552 I/O 1152FBGA |
|
5SGSED6N3F45I4GIntel |
IC FPGA 840 I/O 1932FCBGA |
|
M7A3P1000-FG144Roving Networks / Microchip Technology |
IC FPGA 97 I/O 144FBGA |
|
5SGXEABK2H40I2GIntel |
IC FPGA 696 I/O 1517HBGA |
|
AX500-FG676MRoving Networks / Microchip Technology |
IC FPGA 336 I/O 676FBGA |
|
M2GL050T-FGG896IRoving Networks / Microchip Technology |
IC FPGA 377 I/O 896FBGA |
|
10M16SCU169I7PIntel |
IC FPGA/CPLD MAX10 169UBGA |
|
XCVU13P-1FHGB2104EXilinx |
IC FPGA 702 I/O 2104FCBGA |
|
AFS1500-FGG256KRoving Networks / Microchip Technology |
IC FPGA 119 I/O 256FBGA |