THERMAL INTERFACE PAD, GAP PAD,
16-BIT, FLASH, M16C CPU
类型 | 描述 |
---|---|
系列: | * |
包裹: | Bulk |
零件状态: | Active |
核心处理器: | - |
核心尺寸: | - |
速度: | - |
连通性: | - |
外围设备: | - |
输入/输出数: | - |
程序内存大小: | - |
程序存储器类型: | - |
eeprom大小: | - |
内存大小: | - |
电压 - 电源 (vcc/vdd): | - |
数据转换器: | - |
振荡器类型: | - |
工作温度: | - |
安装类型: | - |
包/箱: | - |
供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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