类型 | 描述 |
---|---|
系列: | - |
包裹: | Tape & Reel (TR) |
零件状态: | Active |
类型: | Biometric Sensor Hub |
输入类型: | Digital |
输出类型: | I²C |
供电: | - |
工作温度: | -40°C ~ 105°C (TA) |
安装类型: | Surface Mount |
包/箱: | 16-WFBGA, WLBGA |
供应商设备包: | 16-WLPBGA (1.55x1.57) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
ZSSC3016CC6BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3135BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
DAC100BIDDQ7Rochester Electronics |
10-BIT CCD SIGNAL PROCESSOR |
|
ZSSC3026CI6CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSC31050FICRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3154BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
AD9976BCPZRLRochester Electronics |
IC PROCESSOR CCD 14BIT LFCSP |
|
ZSSC3131BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3170FE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSC31015EACRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC4165DE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSSC3036CC1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3026CI1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |