类型 | 描述 |
---|---|
系列: | * |
包裹: | Tray |
零件状态: | Active |
类型: | - |
输入类型: | - |
输出类型: | - |
供电: | - |
工作温度: | - |
安装类型: | - |
包/箱: | - |
供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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WAFER (UNSAWN) - BOX |
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ZSC31015EABRenesas Electronics America |
WAFER (UNSAWN) - BOX |
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RE46C181E16Roving Networks / Microchip Technology |
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ZSSC3224BI1BRenesas Electronics America |
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ZSSC3015NE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSSC3016CI1BPRenesas Electronics America |
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ZSSC5101BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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MAX32664GWEB+TMaxim Integrated |
CORTEX M4F 96MHZ ME11, WLP, ALGO |
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TDC-GP30YA-F01 1KScioSense |
TDC-GP30YA-F01 1K QFN40 LF T&R |