English
简体中文
REPL HEATING ELEMENT FOR HG-302A
IC FLASH 8MBIT PARALLEL 48TSOP
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Tray |
| 零件状态: | Obsolete |
| 内存类型: | Non-Volatile |
| 内存格式: | FLASH |
| 技术: | FLASH - NOR |
| 内存大小: | 8Mb (1M x 8, 512K x 16) |
| 内存接口: | Parallel |
| 时钟频率: | - |
| 写周期时间 - 字，页: | 90ns |
| 访问时间: | 90 ns |
| 电压 - 电源: | 2.7V ~ 3.6V |
| 工作温度: | 0°C ~ 70°C (TA) |
| 安装类型: | Surface Mount |
| 包/箱: | 48-TFSOP (0.724", 18.40mm Width) |
| 供应商设备包: | 48-TSOP |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
AT24C04AN-10SCRoving Networks / Microchip Technology |
IC EEPROM 4KBIT I2C 400KHZ 8SOIC |
|
MT41J64M16JT-187E:GMicron Technology |
IC DRAM 1GBIT PARALLEL 96FBGA |
|
W25Q32JVSSJQWinbond Electronics Corporation |
IC FLASH 32MBIT SPI/QUAD 8SOIC |
|
IS49NLC36160-33BISSI (Integrated Silicon Solution, Inc.) |
IC DRAM 576MBIT PAR 144FCBGA |
|
AT28HC64B-90PIRoving Networks / Microchip Technology |
IC EEPROM 64KBIT PARALLEL 28DIP |
|
IDT71P79804S250BQI8Renesas Electronics America |
IC SRAM 18MBIT PARALLEL 165CABGA |
|
W25Q256FVFJQ TRWinbond Electronics Corporation |
IC FLASH 256MBIT SPI/QUAD 16SOIC |
|
IS42S32160B-75TLI-TRISSI (Integrated Silicon Solution, Inc.) |
IC DRAM 512MBIT PAR 86TSOP II |
|
CY14B256L-SP45XCTCypress Semiconductor |
IC NVSRAM 256KBIT PAR 48SSOP |
|
MT46V64M4TG-75:GMicron Technology |
IC DRAM 256MBIT PARALLEL 66TSOP |
|
RMLV0808BGBG-4S2#KC0Renesas Electronics America |
IC SRAM 8MBIT PARALLEL 48TFBGA |
|
7133LA55PFRenesas Electronics America |
IC SRAM 32KBIT PARALLEL 100TQFP |
|
W948D6KBHX6EWinbond Electronics Corporation |
IC DRAM 256MBIT PARALLEL 60VFBGA |