类型 | 描述 |
---|---|
系列: | - |
包裹: | Bag |
零件状态: | Active |
原型板类型: | SMD to DIP |
接受包裹: | SOIC, SOP, SSOP |
职位数: | 18 |
沥青: | 0.100" (2.54mm) |
板厚: | 0.063" (1.60mm) |
材料: | FR4 Epoxy Glass |
尺寸/尺寸: | 0.905" L x 0.744" W (23.00mm x 18.90mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
EVM-LEADED1Texas Instruments |
EVALUATION MODULE |
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PA0159Chip Quik, Inc. |
MICROSMD-14 BGA-14 0.5 MM PITCH |
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QSOP-16 TO DIP-16 SMT ADAPTER (0 |
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PA0203Chip Quik, Inc. |
LQFP-112 TO PGA-112 ADAPTER |
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SOCKET ADAPTER MULT PKG TO 44QFP |
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PA0019Chip Quik, Inc. |
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PA0145Chip Quik, Inc. |
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