SP,CON,AU,TNR 10X3X6MM
SFERNICE THIN FILMS
LOW PROFILE SMART CARD CONN
CONN RCPT FMALE 128P GOLD CRIMP
类型 | 描述 |
---|---|
系列: | B3G |
包裹: | Bulk |
零件状态: | Active |
类型: | - |
形状: | - |
宽度: | - |
长度: | - |
高度: | - |
材料: | - |
电镀: | - |
电镀 - 厚度: | - |
附着方式: | - |
工作温度: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
2286211-3TE Connectivity AMP Connectors |
HIGH CURRENT SPRING FINGER |
|
0097056802Laird - Performance Materials |
FINGERSTOCK BECU 10.4X406.4MM |
|
5411-0001-20-300Leader Tech Inc. |
M83528/011B001, AG/AL FILLED SIL |
|
0097065602Laird - Performance Materials |
FINGERSTOCK BECU 6.35X406.4MM |
|
0097091802Laird - Performance Materials |
FINGERSTOCK BECU 8.9X381MM |
|
67SLG030030050PI00Laird - Performance Materials |
METAL FILM OVER FOAM CONTACTS |
|
331031271520Würth Elektronik Midcom |
CONTACT FINGER EMI SMD |
|
0077005702Laird - Performance Materials |
FINGRSTCK BECU ALY 15.24X406.4MM |
|
19-04-25875-S6305Parker Chomerics |
CHO-SEAL S6305 NI/C 0.050" 1' |
|
SG252280C-48Leader Tech Inc. |
FSG, .252"H X .280"W X 48"L |
|
4212PA51H01800Laird - Performance Materials |
GASKET FAB/FOAM 4.95X457.2MM SQ |
|
2199001-1TE Connectivity AMP Connectors |
RFI SHIELD FINGER GOLD SOLDER |
|
5409-0004-60-300Leader Tech Inc. |
NI/C FILLED SILICONE; 0.125" X . |