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CAMERA CUBE CHIP
THERMAL INTERFACE PAD, GAP PAD,
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Tray |
| 零件状态: | Active |
| 颜色: | RGB |
| 解析度: | 400 x 400 |
| 每秒帧数: | 30 |
| 快门: | - |
| 镜头卡口: | - |
| 传感器: | - |
| 类型: | CMOS |
| 界面: | SPI |
| 像素大小: | 1.75µm x 1.75µm |
| 安装类型: | - |
| 包/箱: | Module |
| 供应商设备包: | Module |
| 尺寸/尺寸: | - |
| 高度（最大）: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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