类型 | 描述 |
---|---|
系列: | R253-5 |
包裹: | Bulk |
零件状态: | Active |
类型: | Solder Paste |
作品: | Sn96.3Ag3.7 (96.3/3.7) |
直径: | - |
熔点: | 430 ~ 444°F (221 ~ 223°C) |
助焊剂类型: | No-Clean |
线规: | - |
过程: | Lead Free |
形式: | Jar, 17.64 oz (500g) |
保质期: | 4 Months |
保质期开始: | Date of Manufacture |
储存/冷藏温度: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
70-4021-0919Kester |
SOLDER PASTE NO CLEAN 750GM |
|
SMD291SNLT7Chip Quik, Inc. |
SOLDER PASTE NO CLEAN LEAD-FREE |
|
70-4823-0910Kester |
NP560 SN96.5AG3.0CU0.5 T4 500 G |
|
BARSN62PB36AG2Chip Quik, Inc. |
SOLDER BAR SN62/PB36/AG2 1LB SUP |
|
04-6040-0050Kester |
SOLDER BAR UP 60/40 1.66LB HAL F |
|
24-7317-9716Kester |
SOLDER FLUX-CORED/285 .0240" 1LB |
|
04-7033-0000Kester |
SOLDER BAR BAR 1.66LB |
|
16-7040-0125Kester |
SOLDER SOLID WIRE .125" 5LB SPL |
|
25-7040-0061Kester |
SOLDER FLUX-CORED/44 .062" 4LB S |
|
70-4102-0611Kester |
SOLDER PASTE NO CLEAN 600GM |
|
NC191LTA500CChip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
4902P-15GMG Chemicals |
LEAD FREE LOW TEMPERATURE SOLDER |
|
SMD2055Chip Quik, Inc. |
SOLDER SPHERES SAC305 .025 DIAM |