类型 | 描述 |
---|---|
系列: | - |
包裹: | Bag |
零件状态: | Active |
类型: | Solder Paste |
作品: | Sn42Bi57Ag1 (42/57/1) |
直径: | - |
熔点: | 279°F (137°C) |
助焊剂类型: | No-Clean |
线规: | - |
过程: | Lead Free |
形式: | Jar, 8.8 oz (250g) |
保质期: | 12 Months |
保质期开始: | Date of Manufacture |
储存/冷藏温度: | 37°F ~ 46°F (3°C ~ 8°C) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
WS991AX500T4Chip Quik, Inc. |
SOLDER PASTE THERMALLY STABLE WS |
|
24-9574-6422Kester |
SOLDER 66 .015 27AWG 1LB |
|
16-7050-0062Kester |
SOLDER SOLID WIRE .062" 5LB SPL |
|
NCSW.020 1LBChip Quik, Inc. |
SOLDER WIRE 63/37 TIN/LEAD NO-CL |
|
SMDSWLT.040 100GChip Quik, Inc. |
SN42/BI57/AG1 2.2 FLUX CORE SOLD |
|
SMDCU100-S-16Chip Quik, Inc. |
SOLDER SHOT CU100 16OZ 454G |
|
SMDSW.031 .7OZChip Quik, Inc. |
SOLDER WIRE POCKET PACK 63/37 TI |
|
SMD2016Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
|
24-7050-0027Kester |
SOLDER RA 9SN6.3/AG3.7 20AWG 1LB |
|
SMD2036Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
|
70-4021-0810Kester |
SOLDER PASTE NO CLEAN 500GM |
|
SMD291AX500T3Chip Quik, Inc. |
SOLDER PASTE SN63/PB37 500G |
|
70-0403-0823Kester |
SOLDER PASTE WATER SOLUBLE 500GM |