SOLDER FLUX-CORED/275 .025" 500G
SFP HSMC DEV BOARD
类型 | 描述 |
---|---|
系列: | 275 |
包裹: | Bulk |
零件状态: | Active |
类型: | Wire Solder |
作品: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
直径: | 0.025" (0.64mm) |
熔点: | 423 ~ 424°F (217 ~ 218°C) |
助焊剂类型: | No-Clean |
线规: | 22 AWG, 23 SWG |
过程: | Lead Free |
形式: | Spool, 17.64 oz (500g) |
保质期: | - |
保质期开始: | - |
储存/冷藏温度: | 50°F ~ 104°F (10°C ~ 40°C) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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