类型 | 描述 |
---|---|
系列: | NXG1 |
包裹: | Bulk |
零件状态: | Active |
类型: | Solder Paste |
作品: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
直径: | - |
熔点: | 423 ~ 424°F (217 ~ 218°C) |
助焊剂类型: | No-Clean |
线规: | - |
过程: | Lead Free |
形式: | Jar, 17.64 oz (500g) |
保质期: | 8 Months |
保质期开始: | Date of Manufacture |
储存/冷藏温度: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
SMDALChip Quik, Inc. |
ALUMINUM SOLDER PASTE WATER-SOLU |
|
92-6337-8825Kester |
SOLDER FLUX-CORED/245 63/37 .024 |
|
SSLFNC-15GSRA Soldering Products |
SAC 305 LEAD FREE SOLDER PASTE T |
|
SR37-LFM23S-3.5-0.8MMAlmit (ANA TRADING) |
SOLDER LEAD-FREE 0.8MM 100G |
|
24-9574-1406Kester |
SOLDER 66 .025 22AWG 1LB |
|
CWSN60WRMAP3 .015Amerway Inc. |
SN60PB40 WRMAP3 .015 DIA 1# SPL |
|
TS391SNL50Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
|
EXB-SN60PB40Chip Quik, Inc. |
SOLDER BAR SN60/PB40 1LB (454G) |
|
SMD2028Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
|
RASW.031 1OZChip Quik, Inc. |
SOLDER WIRE 63/37 TIN/LEAD ROSIN |
|
SMD291AX250T3Chip Quik, Inc. |
SOLDER PASTE SN63/PB37 250G |
|
24-7070-0061Kester |
SOLDER FLUX-CORED/44 .062" 1LB S |
|
EXB-SN96.5AG3.0CU0.5Chip Quik, Inc. |
SOLDER BAR SN96.5/AG3.0/CU0.5 1L |