类型 | 描述 |
---|---|
系列: | NXG1 |
包裹: | Bulk |
零件状态: | Active |
类型: | Solder Paste |
作品: | Sn99.3Cu0.7 (99.3/0.7) |
直径: | - |
熔点: | 441°F (227°C) |
助焊剂类型: | No-Clean |
线规: | - |
过程: | Lead Free |
形式: | Jar, 17.64 oz (500g) |
保质期: | 8 Months |
保质期开始: | Date of Manufacture |
储存/冷藏温度: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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