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RES 1.8 OHM 1% 1/8W 0402
RES 330 OHM 1W 0.25% AXIAL
DIP CBL - HHDM30S/AE30G/HHDM30S
SMA-SJ/SMA-SJ G174 18I
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Active |
| 连接器类型: | DIP to DIP |
| 职位数: | 30 |
| 行数: | 2 |
| 间距连接器: | 0.100" (2.54mm) |
| 间距电缆: | 0.050" (1.27mm) |
| 长度: | 1.50' (457.20mm) |
| 特征: | - |
| 颜色: | Gray, Ribbon |
| 屏蔽: | Unshielded |
| 用法: | Socket (0.1"), Board In |
| 电缆终端: | IDC |
| 接触完成: | Tin |
| 接触面厚度: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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