CAP CER 0.1UF 630V X7T SMD
MULTI-LAYER CHIP BEAD
类型 | 描述 |
---|---|
系列: | MEGACAP, CKG |
包裹: | Tape & Reel (TR)Cut Tape (CT) |
零件状态: | Not For New Designs |
电容: | 0.1 µF |
宽容: | ±20% |
额定电压: | 630V |
温度系数: | X7T |
工作温度: | -55°C ~ 125°C |
特征: | Low ESL |
收视率: | - |
应用: | SMPS Filtering, Bypass, Decoupling |
失败率: | - |
安装类型: | Surface Mount, MLCC |
包/箱: | Nonstandard SMD |
尺寸/尺寸: | 0.142" L x 0.102" W (3.60mm x 2.60mm) |
坐姿高度(最大): | - |
厚度(最大): | 0.136" (3.45mm) |
引线间距: | - |
领导风格: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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