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| 类型 | 描述 |
|---|---|
| 系列: | ESD SMD Comm C0G |
| 包裹: | Bulk |
| 零件状态: | Active |
| 电容: | 0.015 µF |
| 宽容: | ±1% |
| 额定电压: | 25V |
| 温度系数: | C0G, NP0 |
| 工作温度: | -55°C ~ 125°C |
| 特征: | Low ESL, Soft Termination |
| 收视率: | - |
| 应用: | Boardflex Sensitive, ESD Protection |
| 失败率: | - |
| 安装类型: | Surface Mount, MLCC |
| 包/箱: | 0805 (2012 Metric) |
| 尺寸/尺寸: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| 坐姿高度（最大）: | - |
| 厚度（最大）: | 0.055" (1.40mm) |
| 引线间距: | - |
| 领导风格: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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