类型 | 描述 |
---|---|
系列: | Edge Rate™ HSEC8 |
包裹: | Tray |
零件状态: | Active |
卡的种类: | Non Specified - Dual Edge |
性别: | Female |
位置数/托架/行: | 25 |
职位数: | 50 |
卡片厚度: | 0.062" (1.57mm) |
行数: | 2 |
沥青: | 0.031" (0.80mm) |
读出: | Dual |
特征: | Board Guide, Locking Ramp |
安装类型: | Surface Mount |
终止: | Solder |
接触材料: | Beryllium Copper |
接触完成: | Gold |
接触面厚度: | 10.0µin (0.25µm) |
联系方式: | Cantilever |
颜色: | Black |
法兰特征: | - |
工作温度: | -55°C ~ 125°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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