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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Tray |
| 零件状态: | Active |
| 卡的种类: | Non Specified - Dual Edge, Bi-Level |
| 性别: | Female |
| 位置数/托架/行: | 80 |
| 职位数: | 160 |
| 卡片厚度: | 0.062" (1.57mm) |
| 行数: | 2 |
| 沥青: | 0.100" (2.54mm) |
| 读出: | Dual |
| 特征: | Bi-Level - High Density |
| 安装类型: | Through Hole, Right Angle |
| 终止: | Solder |
| 接触材料: | Beryllium Copper |
| 接触完成: | Gold |
| 接触面厚度: | 30.0µin (0.76µm) |
| 联系方式: | Cantilever |
| 颜色: | Black |
| 法兰特征: | Side Mount Opening, Unthreaded, 0.125" (3.18mm) Dia |
| 工作温度: | -65°C ~ 150°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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