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IC FPGA 150 I/O 324FBGA
CONN RCPT MALE 5POS SOLDER CUP
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| 类型 | 描述 |
|---|---|
| 系列: | Middle |
| 包裹: | Bulk |
| 零件状态: | Active |
| 连接器类型: | Receptacle, Male Pins |
| 职位数: | 5 |
| 外壳尺寸 - 插入: | - |
| 外壳尺寸，密尔: | - |
| 安装类型: | Panel Mount |
| 安装功能: | Bulkhead - Rear Side Nut |
| 终止: | Solder Cup |
| 紧固类型: | Push-Twist |
| 方向: | Keyed |
| 外壳材质: | Polyamide (PA66), Nylon 6/6 |
| 外壳饰面: | - |
| 接触完成 - 交配: | Gold |
| 颜色: | Black, Yellow |
| 入口保护: | IP67 - Dust Tight, Waterproof |
| 材料可燃性等级: | - |
| 特征: | - |
| 屏蔽: | Unshielded |
| 额定电流（安培）: | 20A |
| 额定电压: | 125V |
| 电缆开口: | - |
| 工作温度: | -45°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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