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IC DRAM 512MBIT PAR 66TSOP II
![DTS24T13-08SA-3028 [V001]](http://cdn-us.gangbo-ic.com/images/pages/thumb-product-image.jpg)
RECP ASSY
![DTS24T13-08SA-3028 [V001]](http://cdn-us.gangbo-ic.com/images/pages/product-image.jpg)
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| 类型 | 描述 |
|---|---|
| 系列: | * |
| 包裹: | Bag |
| 零件状态: | Active |
| 连接器类型: | - |
| 职位数: | - |
| 外壳尺寸 - 插入: | - |
| 外壳尺寸，密尔: | - |
| 安装类型: | - |
| 安装功能: | - |
| 终止: | - |
| 紧固类型: | - |
| 方向: | - |
| 外壳材质: | - |
| 外壳饰面: | - |
| 接触完成 - 交配: | - |
| 颜色: | - |
| 入口保护: | - |
| 材料可燃性等级: | - |
| 特征: | - |
| 屏蔽: | - |
| 额定电流（安培）: | - |
| 额定电压: | - |
| 电缆开口: | - |
| 工作温度: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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