CONTACT SPRING LOADED SMD 10PC
IC FLASH NAND 4G PAR 63VFBGA
类型 | 描述 |
---|---|
系列: | - |
包裹: | - |
零件状态: | Active |
联系方式: | Sleeve & Plunger (Pogo Pins) |
安装类型: | Surface Mount |
最大工作高度: | 0.630" (16.00mm) |
推荐工作高度: | - |
最小工作高度: | 0.512" (13.00mm) |
焊盘布局尺寸: | - |
操作力 - 初始: | - |
操作力 - 中压缩: | - |
柱塞尺寸: | 0.028" (0.70mm) Dia |
特征: | Needle Head |
交配周期: | - |
接触材料: | - |
接触完成: | Gold |
接触面厚度: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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