IC DRAM 128MBIT PARALLEL 90TFBGA
CONN FPC BOTTOM 17POS 0.30MM R/A
类型 | 描述 |
---|---|
系列: | IL-FHJ |
包裹: | Tray |
零件状态: | Obsolete |
扁平弯曲型: | FPC |
安装类型: | Surface Mount, Right Angle |
连接器/触点类型: | Contacts, Bottom |
职位数: | 17 |
沥青: | 0.012" (0.30mm) |
终止: | Solder |
ffc, fcb 厚度: | 0.20mm |
离板高度: | 0.079" (2.00mm) |
锁定功能: | Flip Lock |
电缆端型: | Tapered |
接触材料: | Copper Alloy |
接触完成: | Gold |
筑屋材料: | Liquid Crystal Polymer (LCP), Glass Filled |
执行器材料: | Polyphenylene Sulfide (PPS), Glass Filled |
特征: | Low Insertion Force (LIF) |
额定电压: | 50V |
工作温度: | -40°C ~ 85°C |
材料可燃性等级: | UL94 V-0 |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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