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CONN RCPT 80POS SMD GOLD
DICE (WAFER SAWN) - WAFFLE PACK
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| 类型 | 描述 |
|---|---|
| 系列: | KX14 |
| 包裹: | Tray |
| 零件状态: | Active |
| 连接器类型: | Receptacle, Outer Shroud Contacts |
| 职位数: | 80 |
| 沥青: | 0.031" (0.80mm) |
| 行数: | 2 |
| 安装类型: | Surface Mount |
| 特征: | Board Guide, Solder Retention |
| 接触完成: | Gold |
| 接触面厚度: | 3.94µin (0.10µm) |
| 配对堆叠高度: | 10mm, 11mm, 12mm |
| 离板高度: | 0.376" (9.55mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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